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詳細介紹
描述
FEATURES
Newly designed, heating application for 8 zone (5 preheating and 3 refl ow) profi le construction has realized more detailed time setting for different refl ow peak temperature.
The compactly designed profi le will be applicable to the parts weak in heat resistance, and also multi-control of heating temperatures will provide suffi cient heating time to assure good quality of solderability.
SPECIFICATIONS
| Applicable boards | MAX. W250×L330 (mm) MIN. W 50×L 50 (mm) |
| Component height | Upper MAX. 20mm Lower MAX. 20mm |
| Circuit board height allowance | 4mm |
| N2 Gas supply | 99.99% 0.4~0.7MPa 250NL/min |
| Flow height from floor | 900±20mm |
| Power source | AC200V-50/60Hz-3φ 61kVA 176A （at flipflop start 32kVA 92A） |
| Dimensions of machine | W1310×L5300×H1370 (mm) |
| Weight | approx. 2100kg |
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