加工優勢 1. 激光劃片屬于非接觸式加工，可以避免出現芯片破碎和其它損壞現象2. 采用的高光束質量的光纖激光器對芯片的電性影響小，可提高的劃片成品率3. 激光劃片速度快，高達300mm/s；4. 激光可以對不同厚度與大小的晶圓進行作業，具有更好的兼容性和通用性；5. 激光劃片不需要去離子水，不存在刀具磨損問題，并可連續24小時作業。ADVANTAGES1. Laser scribin......

加工優勢 1. 激光劃片屬于非接觸式加工，可以避免出現芯片破碎和其它損壞現象2. 采用的高光束質量的光纖激光器對芯片的電性影響小，可提高的劃片成品率3. 激光劃片速度快，高達300mm/s；4. 激光可以對不同厚度與大小的晶圓進行作業，具有更好的兼容性和通用性；5. 激光劃片不需要去離子水，不存在刀具磨損問題，并可連續24小時作業。ADVANTAGES1. Laser scribing belongs to non-contact processing, which can avoid chip breakage and other damage.2. The high beam quality fiber laser used has little influence on the chip's electrical properties and can improve the dicing yield.3. Laser scribing speed is up to 300 mm/s.4. Lasers can work on wafers of different thickness and size, which has better compatibility and versatility.5. Laser dicing does not need for deionized water, does not have tool wear problem, and can be operated continuously for 24 hours.