應用領域及適用范圍：

主要用于多晶硅的磨方、倒角、磨面，單晶硅的磨面、滾圓。

Application

Mainly used for flat grinding and chamfering of polycrystalline silicon; flat and cylindrical grinding monocrystalline silicon.

主要特點：

高速高效磨削、使用壽命長、材料去除效率高、加工工件表面損傷層低、光潔度高。

Characteristics:

High speed and high efficiency grinding,long life span, high efficiency on stock removal, less damage and good finish of workpiece surface.

產品規格Specification