減薄砂輪主要應(yīng)用于半導(dǎo)體晶圓的減薄與精研加工。我公司生產(chǎn)的減薄砂輪可替代進口產(chǎn)品，在日本、德國、美國、韓國及國產(chǎn)磨床上穩(wěn)定使用，砂輪磨削性能*，性價比高。

Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.

Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.

加工對象：分立器件、集成電路襯底及原始晶片等。

工件材料：單晶硅、砷化鎵、磷化銦、碳化硅等半導(dǎo)體材料。

應(yīng)用工序：背面減薄、正面磨削的粗磨加工和精研加工。

Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Applications: back thinning, rough grinding and fine grinding.